Factory Lead Time  

23 Weeks

Mount  

Surface Mount

Mounting Type  

Surface Mount

Package / Case  

8-SOIC (0.154, 3.90mm Width)

Number of Pins  

8

Weight  

73.992255mg

Transistor Element Material  

SILICON

Number of Elements  

2

Turn Off Delay Time  

35 ns

Operating Temperature  

-55°C~150°C TJ

Packaging  

Tape & Reel (TR)

Published  

2011

JESD-609 Code  

e3

Part Status  

Active

Moisture Sensitivity Level (MSL)  

1 (Unlimited)

Number of Terminations  

8

ECCN Code  

EAR99

Terminal Finish  

Matte Tin (Sn)

Additional Feature  

HIGH RELIABILITY

Max Power Dissipation  

1.5W

Terminal Form  

GULL WING

Peak Reflow Temperature (Cel)  

260

Time@Peak Reflow Temperature-Max (s)  

30

Reference Standard  

AEC-Q101

Number of Channels  

2

Element Configuration  

Dual

Operating Mode  

ENHANCEMENT MODE

Power Dissipation  

1.5W

Turn On Delay Time  

3.5 ns

Power - Max  

1.2W

FET Type  

2 N-Channel (Dual)

Transistor Application  

SWITCHING

Rds On (Max) @ Id, Vgs  

80m Ω @ 12A, 10V

Vgs(th) (Max) @ Id  

3V @ 250μA

Input Capacitance (Ciss) (Max) @ Vds  

588pF @ 30V

Gate Charge (Qg) (Max) @ Vgs  

12.3nC @ 10V

Rise Time  

4.1ns

Drain to Source Voltage (Vdss)  

60V

Fall Time (Typ)  

11 ns

Continuous Drain Current (ID)  

3.3A

Gate to Source Voltage (Vgs)  

20V

Drain to Source Breakdown Voltage  

60V

Avalanche Energy Rating (Eas)  

5.9 mJ

FET Technology  

METAL-OXIDE SEMICONDUCTOR

FET Feature  

Logic Level Gate

Height  

1.5mm

Length  

4.95mm

Width  

3.95mm

Radiation Hardening  

No

RoHS Status  

ROHS3 Compliant